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CL31C681JHHNNNF

CL31C681JHHNNNF

CL31C681JHHNNNF

Samsung Semiconductor

CL31C681JHHNNNF datasheet pdf and Unclassified product details from Samsung Semiconductor stock available on our website

SOT-23

CL31C681JHHNNNF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case 1206
Terminal Shape WRAPAROUND
PackagingTape & Reel
Tolerance 5%
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient30ppm/Cel ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Max Operating Temperature125°C
Min Operating Temperature -55°C
HTS Code8532.24.00.20
Capacitance 680pF
Voltage - Rated DC 630V
Packing Method TR, EMBOSSED, 13 INCH
Depth 1.6mm
Capacitor Type CERAMIC CAPACITOR
Dielectric C0G
Temperature Characteristics Code C0G
Multilayer Yes
Height 1.6mm
Length 3.2mm
Width 1.6002mm
Thickness 1.8034mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:3994 items

About CL31C681JHHNNNF

The CL31C681JHHNNNF from Samsung Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features CL31C681JHHNNNF datasheet pdf and Unclassified product details from Samsung Semiconductor stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CL31C681JHHNNNF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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