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CL03C9R1BA3GNNH

CL03C9R1BA3GNNH

CL03C9R1BA3GNNH

Samsung Semiconductor

CL03C9R1BA3GNNH datasheet pdf and Unclassified product details from Samsung Semiconductor stock available on our website

SOT-23

CL03C9R1BA3GNNH Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case 0201
Terminal Shape WRAPAROUND
PackagingTape & Reel
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient30ppm/Cel ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Max Operating Temperature125°C
Min Operating Temperature -55°C
HTS Code8532.24.00.20
Capacitance 9.1pF
Voltage - Rated DC 25V
Packing Method TR, CARDBOARD, 7 INCH
Depth 300μm
Capacitor Type CERAMIC CAPACITOR
Dielectric C0G
Temperature Characteristics Code C0G
Multilayer Yes
Positive Tolerance 1.1%
Negative Tolerance 1.1%
Height 300μm
Length 600μm
Width 304.8μm
Thickness 330.2μm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:1518 items

About CL03C9R1BA3GNNH

The CL03C9R1BA3GNNH from Samsung Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features CL03C9R1BA3GNNH datasheet pdf and Unclassified product details from Samsung Semiconductor stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CL03C9R1BA3GNNH, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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