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M471B5173DB0-YK000

M471B5173DB0-YK000

M471B5173DB0-YK000

Samsung Electronics

M471B5173DB0-YK000 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

SOT-23

M471B5173DB0-YK000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 8
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.35
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks Single
CAS Latency 11
Standard Package Name DIM
Supplier Package USODIMM
Mounting Socket
Package Height 30
Package Length 67.6
Package Width 3.8(Max)
PCB changed 204
Lead Shape No Lead
Part StatusObsolete
Pin Count204
Organization 512Mx64
Module Type 204USODIMM
RoHS StatusRoHS Compliant
In-Stock:3623 items

About M471B5173DB0-YK000

The M471B5173DB0-YK000 from Samsung Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features M471B5173DB0-YK000 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the M471B5173DB0-YK000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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