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M386B4G70DM0-CMA30

M386B4G70DM0-CMA30

M386B4G70DM0-CMA30

Samsung Electronics

M386B4G70DM0-CMA30 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

SOT-23

M386B4G70DM0-CMA30 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) 4A994.a
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 36
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1866
Chip Configuration 2Gx4
Chip Package Type 78FBGA
Typical Operating Supply Voltage (V) 1.5
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks Quad
CAS Latency 13
Supplier Package LRDIMM
Mounting Socket
Package Height 30.35
Package Length 133.35
Package Width 4.8(Max)
PCB changed 240
Part StatusObsolete
Pin Count240
Organization 4Gx72
Module Type 240LRDIMM
In-Stock:1267 items

About M386B4G70DM0-CMA30

The M386B4G70DM0-CMA30 from Samsung Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features M386B4G70DM0-CMA30 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the M386B4G70DM0-CMA30, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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