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M386A8K40CM2-CVF

M386A8K40CM2-CVF

M386A8K40CM2-CVF

Samsung Electronics

M386A8K40CM2-CVF datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

SOT-23

M386A8K40CM2-CVF Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
HTS 8473.30.11.40
Module DRAM Module
Module Density 64Gbyte
Number of Chip per Module 36
Chip Density (bit) 16G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.165
Maximum Clock Rate (MHz) 2933
Chip Configuration 4Gx4
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Supplier Temperature Grade Extended
Module Sides Double
ECC Support Yes
Number of Ranks Quad
Number of Chip Banks 16
CAS Latency 21
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
Package Width 4.3(Max)
PCB changed 288
Part StatusActive
Pin Count288
Organization 8Gx72
PLL No
Self Refresh Yes
Module Type 288LRDIMM
In-Stock:2927 items

About M386A8K40CM2-CVF

The M386A8K40CM2-CVF from Samsung Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features M386A8K40CM2-CVF datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the M386A8K40CM2-CVF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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