Welcome to Hotenda.com Online Store!

logo
userjoin
Home

CIG21FR47MNC

CIG21FR47MNC

CIG21FR47MNC

Samsung Electro-Mechanics

Inductor Power Chip Shielded Multi-Layer 470nH 20% 1MHz Ferrite 1.1A 120mOhm DCR 0805 Paper T/R

SOT-23

CIG21FR47MNC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0805 (2012 Metric)
Core MaterialFerrite
Operating Temperature-40°C~125°C
PackagingDigi-Reel®
Published 2014
Series CIG21F
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
Tolerance ±20%
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Multilayer
Max Operating Temperature125°C
Min Operating Temperature -40°C
Current Rating (Amps) 1.1A
Shielding Shielded
Depth 1.35mm
Current Rating1.1A
Military Standard Not
Case Code (Metric) 2012
Case Code (Imperial) 0805
Inductance 470nH
Test Frequency1MHz
DC Resistance (DCR) 120mOhm
Max DC Current 1.1A
Inductance Frequency - Test 1MHz
DC Current 1.1A
Height 500μm
Length 2.0066mm
Width 1.2446mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1073 items

About CIG21FR47MNC

The CIG21FR47MNC from Samsung Electro-Mechanics is a high-performance microcontroller designed for a wide range of embedded applications. This component features Inductor Power Chip Shielded Multi-Layer 470nH 20% 1MHz Ferrite 1.1A 120mOhm DCR 0805 Paper T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CIG21FR47MNC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News