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CIG10FR47MNC

CIG10FR47MNC

CIG10FR47MNC

Samsung Electro-Mechanics

FIXED IND 470NH 800MA 200 MOHM

SOT-23

CIG10FR47MNC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0603 (1608 Metric)
Supplier Device Package 0603 (1608 Metric)
Core MaterialFerrite
Operating Temperature-40°C~125°C
PackagingDigi-Reel®
Published 2013
Series CIG10F
Size / Dimension 0.063Lx0.031W 1.60mmx0.80mm
Tolerance ±20%
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Multilayer
Max Operating Temperature125°C
Min Operating Temperature -40°C
Current Rating (Amps) 800mA
Shielding Shielded
Depth 950μm
Current Rating800mA
Case Code (Metric) 1608
Case Code (Imperial) 0603
Inductance 470nH
Test Frequency1MHz
DC Resistance (DCR) 200mOhm
Max DC Current 800mA
Inductance Frequency - Test 1MHz
Height 500μm
Length 1.6002mm
Width 787.4μm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:27590 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$9.213440$9.21344
10$8.691925$86.91925
100$8.199929$819.9929
500$7.735782$3867.891
1000$7.297907$7297.907

About CIG10FR47MNC

The CIG10FR47MNC from Samsung Electro-Mechanics is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 470NH 800MA 200 MOHM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CIG10FR47MNC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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