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63PK1000MEFC16X25

63PK1000MEFC16X25

63PK1000MEFC16X25

Rubycon

Cap Aluminum 1000uF 63V 20% (16 X 25mm) Radial Aluminum Cylindrical Can 7.5mm 1350mA 2000 hr 85C Bulk

SOT-23

63PK1000MEFC16X25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-40°C~85°C
PackagingBulk
Published 2011
Series PK
Size / Dimension 0.630Dia 16.00mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
Applications General Purpose
Capacitance 1000μF
Lead Pitch 7.5mm
Lead Spacing0.295 7.50mm
Lead Diameter 800 μm
Voltage 63V
Lifetime @ Temp 2000 Hrs @ 85°C
Leakage Current 3μA
Ripple Current1.35A
Polarization Polar
Ripple Current @ Low Frequency 1.25A @ 120Hz
Ripple Current @ High Frequency 1.5A @ 10kHz
Diameter 16mm
Height 25mm
Height Seated (Max) 1.043 26.50mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:10715 items

Pricing & Ordering

QuantityUnit PriceExt. Price
600$0.69615$417.69

About 63PK1000MEFC16X25

The 63PK1000MEFC16X25 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features Cap Aluminum 1000uF 63V 20% (16 X 25mm) Radial Aluminum Cylindrical Can 7.5mm 1350mA 2000 hr 85C Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 63PK1000MEFC16X25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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