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6.3ZLJ4700M12.5X25

6.3ZLJ4700M12.5X25

6.3ZLJ4700M12.5X25

Rubycon

CAP ALUM 4700UF 20% 6.3V RADIAL

SOT-23

6.3ZLJ4700M12.5X25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-40°C~105°C
PackagingBulk
Series ZLJ
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Radial
Applications General Purpose
Capacitance 4700μF
Voltage - Rated DC 6.3V
Lead Pitch 5mm
Lead Spacing0.197 5.00mm
Lifetime @ Temp 10000 Hrs @ 105°C
Ripple Current2A
Polarization Polar
Life (Hours) 10000 hours
Impedance19mOhm
Ripple Current @ Low Frequency 2.03A @ 120Hz
Ripple Current @ High Frequency 2.9A @ 100kHz
Ripple Current (AC) 2.9A
Diameter 12.5mm
Height 25mm
Height Seated (Max) 1.063 27.00mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
In-Stock:5281 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.321819$1.321819
10$1.246999$12.46999
100$1.176414$117.6414
500$1.109825$554.9125
1000$1.047005$1047.005

About 6.3ZLJ4700M12.5X25

The 6.3ZLJ4700M12.5X25 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 4700UF 20% 6.3V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 6.3ZLJ4700M12.5X25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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