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6.3ZLG3300MEFC12.5X20

6.3ZLG3300MEFC12.5X20

6.3ZLG3300MEFC12.5X20

Rubycon

CAP ALUM 3300UF 20% 6.3V RADIAL

SOT-23

6.3ZLG3300MEFC12.5X20 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Dielectric MaterialALUMINUM
Operating Temperature-40°C~105°C
PackagingBulk
Series ZLG
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Applications General Purpose
Capacitance 3300μF
Voltage - Rated DC 6.3V
Lead Pitch 5.0038mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.197 5.00mm
Lifetime @ Temp 5000 Hrs @ 105°C
Ripple Current2.48A
Polarization Polar
Life (Hours) 5000 hours
Impedance13mOhm
Ripple Current @ Low Frequency 1.736A @ 120Hz
Diameter 12.5mm
Height 20mm
Height Seated (Max) 0.866 22.00mm
RoHS StatusROHS3 Compliant
In-Stock:14959 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.47000$0.47
500$0.4653$232.65
1000$0.4606$460.6
1500$0.4559$683.85
2000$0.4512$902.4
2500$0.4465$1116.25

About 6.3ZLG3300MEFC12.5X20

The 6.3ZLG3300MEFC12.5X20 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 3300UF 20% 6.3V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 6.3ZLG3300MEFC12.5X20, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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