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6.3ZLG2200MEFC10X23

6.3ZLG2200MEFC10X23

6.3ZLG2200MEFC10X23

Rubycon

CAP ALUM 2200UF 20% 6.3V RADIAL

SOT-23

6.3ZLG2200MEFC10X23 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Dielectric MaterialALUMINUM
Operating Temperature-40°C~105°C
PackagingBulk
Series ZLG
Size / Dimension 0.394Dia 10.00mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Applications General Purpose
Capacitance 2200μF
Voltage - Rated DC 6.3V
Terminal Pitch5mm
Lead Pitch 5.0038mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.197 5.00mm
Lifetime @ Temp 4000 Hrs @ 105°C
Ripple Current2.36A
Polarization Polar
Life (Hours) 4000 hours
Impedance13mOhm
Ripple Current @ Low Frequency 1.652A @ 120Hz
Diameter 10mm
Height 23mm
Height Seated (Max) 0.984 25.00mm
RoHS StatusROHS3 Compliant
In-Stock:20327 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.795678$0.795678
10$0.750640$7.5064
100$0.708150$70.815
500$0.668067$334.0335
1000$0.630251$630.251

About 6.3ZLG2200MEFC10X23

The 6.3ZLG2200MEFC10X23 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 2200UF 20% 6.3V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 6.3ZLG2200MEFC10X23, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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