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6.3PX3300MEFC10X20

6.3PX3300MEFC10X20

6.3PX3300MEFC10X20

Rubycon

CAP ALUM 3300UF 20% 6.3V RADIAL

SOT-23

6.3PX3300MEFC10X20 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-55°C~105°C
PackagingBulk
Series PX
Size / Dimension 0.394Dia 10.00mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
ECCN Code EAR99
Applications General Purpose
HTS Code8532.24.0060
Capacitance 3300μF
Lead Pitch 5mm
Lead Spacing0.197 5.00mm
Lead Diameter 600 μm
Voltage 6.3V
Lifetime @ Temp 2000 Hrs @ 105°C
Leakage Current 3μA
Ripple Current985mA
Polarization Polar
Life (Hours) 2000 hours
Ripple Current @ Low Frequency 985mA @ 120Hz
Ripple Current @ High Frequency 1.13275A @ 10kHz
Diameter 10mm
Height 20mm
Height Seated (Max) 0.866 22.00mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:9232 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.890000$0.89
10$0.839623$8.39623
100$0.792097$79.2097
500$0.747261$373.6305
1000$0.704963$704.963

About 6.3PX3300MEFC10X20

The 6.3PX3300MEFC10X20 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 3300UF 20% 6.3V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 6.3PX3300MEFC10X20, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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