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400MXR56M20X25

400MXR56M20X25

400MXR56M20X25

Rubycon

MXR Series 56 uF 400 V ± 20 % Through Hole Aluminum Electrolytic Capacitor

SOT-23

400MXR56M20X25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can - Snap-In
Dielectric MaterialALUMINUM (WET)
Operating Temperature-25°C~105°C
PackagingBulk
Published 2002
Series MXR
Size / Dimension 0.787Dia 20.00mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Applications General Purpose
Voltage - Rated 400V
Capacitance 56μF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.394 10.00mm
Rated (DC) Voltage (URdc) 400V
Lifetime @ Temp 3000 Hrs @ 105°C
Leakage Current 0.448999mA
Polarization Polar
Tan Delta 0.15
Ripple Current @ Low Frequency 400mA @ 120Hz
Ripple Current @ High Frequency 460mA @ 10kHz
Height Seated (Max) 1.063 27.00mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:3826 items

Pricing & Ordering

QuantityUnit PriceExt. Price
200$1.69785$339.57

About 400MXR56M20X25

The 400MXR56M20X25 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features MXR Series 56 uF 400 V ± 20 % Through Hole Aluminum Electrolytic Capacitor.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 400MXR56M20X25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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