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35YXG470MEFC12.5X16

35YXG470MEFC12.5X16

35YXG470MEFC12.5X16

Rubycon

CAP ALUM 470UF 20% 35V RADIAL

SOT-23

35YXG470MEFC12.5X16 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-40°C~105°C
PackagingBulk
Series YXG
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Radial
ECCN Code EAR99
Applications General Purpose
HTS Code8532.24.0060
Capacitance 470μF
Voltage - Rated DC 35V
Lead Pitch 5.0038mm
Lead Spacing0.197 5.00mm
Lifetime @ Temp 6000 Hrs @ 105°C
Ripple Current797.5mA
Polarization Polar
Life (Hours) 6000 hours
Impedance49mOhm
Ripple Current @ Low Frequency 797.5mA @ 120Hz
Ripple Current @ High Frequency 1.45A @ 100kHz
Diameter 12.5mm
Height 16mm
Height Seated (Max) 0.689 17.50mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:29636 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.858686$0.858686
10$0.810080$8.1008
100$0.764227$76.4227
500$0.720969$360.4845
1000$0.680160$680.16

About 35YXG470MEFC12.5X16

The 35YXG470MEFC12.5X16 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 470UF 20% 35V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 35YXG470MEFC12.5X16, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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