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25JEV10M4X5.5

25JEV10M4X5.5

25JEV10M4X5.5

Rubycon

CAP ALUM 10UF 20% 25V SMD

SOT-23

25JEV10M4X5.5 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Radial, Can - SMD
Terminal Shape FLAT
Dielectric MaterialALUMINUM (WET)
Surface Mount Land Size 0.169Lx0.169W 4.30mmx4.30mm
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Series JEV
Size / Dimension 0.157Dia 4.00mm
Tolerance ±20%
JESD-609 Code e6
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Tin/Bismuth (Sn/Bi)
Applications High Temperature Reflow
Voltage - Rated 25V
Capacitance 10μF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Rated (DC) Voltage (URdc) 25V
Size Code 1717
Lifetime @ Temp 2000 Hrs @ 85°C
Ripple Current25mA
Polarization Polar
Life (Hours) 2000 hours
Ripple Current @ Low Frequency 25mA @ 120Hz
Ripple Current @ High Frequency 37.5mA @ 10kHz
Height Seated (Max) 0.217 5.50mm
RoHS StatusROHS3 Compliant
In-Stock:82081 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 25JEV10M4X5.5

The 25JEV10M4X5.5 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 10UF 20% 25V SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 25JEV10M4X5.5, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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