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16ZL470MEFCT810X12.5

16ZL470MEFCT810X12.5

16ZL470MEFCT810X12.5

Rubycon

CAP ALUM 470UF 20% 16V RADIAL

SOT-23

16ZL470MEFCT810X12.5 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~105°C
PackagingTape & Box (TB)
Series ZL
Size / Dimension 0.394Dia 10.00mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Radial
ECCN Code EAR99
Applications General Purpose
Voltage - Rated 16V
Capacitance 470μF
Lead Pitch 5mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.197 5.00mm
Rated (DC) Voltage (URdc) 16V
Lifetime @ Temp 4000 Hrs @ 105°C
Ripple Current1.03A
Polarization Polar
Life (Hours) 4000 hours
Impedance53mOhm
Ripple Current @ Low Frequency 566.5mA @ 120Hz
Ripple Current @ High Frequency 1.03A @ 100kHz
Diameter 10mm
Height 12.5mm
Height Seated (Max) 0.551 14.00mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:27353 items

Pricing & Ordering

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About 16ZL470MEFCT810X12.5

The 16ZL470MEFCT810X12.5 from Rubycon is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 470UF 20% 16V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 16ZL470MEFCT810X12.5, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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