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SH8MUT70TB1

SH8MUT70TB1

SH8MUT70TB1

ROHMSEMICONDUCTOR

SH8MUT70TB1 datasheet pdf and Evaluation, Development Board Enclosures product details from ROHMSEMICONDUCTOR stock available on our website

SOT-23

SH8MUT70TB1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 7 months ago)
Lifecycle Status 5 Weeks
Mount Through Hole
Mounting Type Flanges
Package / Case 8-DIP (0.300, 7.62mm)
Number of Pins 6
Operating Temperature -40°C ~ 110°C
Packaging Box
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 6
ECCN Code -
Temperature Coefficient -
Subcategory Other Regulators
Voltage - Supply 20V ~ 50V
Base Part Number Bqgov Cpf
Output Voltage 81 V
Output Type Analog Voltage
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 80 μA
Nominal Supply Current 1 μA
Output Current 60 mA
Max Supply Current 1 mA
Slew Rate 0.3V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type General Purpose
In-Stock:2222 items

About SH8MUT70TB1

The SH8MUT70TB1 from ROHMSEMICONDUCTOR is a high-performance microcontroller designed for a wide range of embedded applications. This component features SH8MUT70TB1 datasheet pdf and Evaluation, Development Board Enclosures product details from ROHMSEMICONDUCTOR stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SH8MUT70TB1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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