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MNR32J0ABJ183

MNR32J0ABJ183

MNR32J0ABJ183

ROHM Semiconductor

MNR32J0ABJ183 datasheet pdf and Resistor Networks, Arrays product details from ROHM Semiconductor stock available on our website

SOT-23

MNR32J0ABJ183 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case 1210
Terminal Shape WRAPAROUND
Number of Pins 4
PackagingTape & Reel (TR)
Tolerance 5%
JESD-609 Code e3
Number of Terminations 4
ECCN Code EAR99
Temperature Coefficient200 ppm/°C
Resistance 18kOhm
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Max Operating Temperature125°C
Min Operating Temperature -55°C
Subcategory ARRAY/NETWORK RESISTOR
Power Rating 125mW
Voltage - Rated DC 200V
Packing Method TR, EMBOSSED, 7 INCH
Technology METAL GLAZE/THICK FILM
Number of Functions 2
Construction Chip
Resistor Type ARRAY/NETWORK RESISTOR
Number of Elements 1
Rated Temperature 70°C
Number of Resistors 2
Circuit TypeIsolated
Power Per Element 125mW
Height 660.4μm
Length 3.0988mm
Width 2.5908mm
RoHS StatusRoHS Compliant
In-Stock:3247 items

About MNR32J0ABJ183

The MNR32J0ABJ183 from ROHM Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features MNR32J0ABJ183 datasheet pdf and Resistor Networks, Arrays product details from ROHM Semiconductor stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MNR32J0ABJ183, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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