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MNR15E0RPJ111

MNR15E0RPJ111

MNR15E0RPJ111

ROHM Semiconductor

MNR15E0RPJ111 datasheet pdf and Resistor Networks, Arrays product details from ROHM Semiconductor stock available on our website

SOT-23

MNR15E0RPJ111 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case Molded
Surface MountYES
Terminal Shape WRAPAROUND
Mounting FeatureSURFACE MOUNT
Number of Pins 10
Tolerance 5%
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 10
ECCN Code EAR99
Temperature Coefficient200 ppm/°C
Resistance 110Ohm
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Composition Thick Film
Power Rating 31mW
Voltage - Rated DC 12.5V
Packing Method TR, PAPER, 7 INCH
Number of Functions 1
Construction Chip
Resistor Type ARRAY/NETWORK RESISTOR
Reference Standard AEC-Q200
Rated Power Dissipation (P) 0.031W
Operating Temperature (Max) 125°C
Operating Temperature (Min) -55°C
Number of Elements 8
Size Code 1206
Rated Temperature 70°C
Network Type BUSSED
Height 500μm
Length 3.2mm
Width 1.6mm
RoHS StatusNon-RoHS Compliant
In-Stock:3096 items

About MNR15E0RPJ111

The MNR15E0RPJ111 from ROHM Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features MNR15E0RPJ111 datasheet pdf and Resistor Networks, Arrays product details from ROHM Semiconductor stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MNR15E0RPJ111, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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