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BU7322HFV-TR

BU7322HFV-TR

BU7322HFV-TR

ROHM Semiconductor

IC CLK GENERATOR 1CH 6-HVSOF

SOT-23

BU7322HFV-TR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-SMD, Flat Lead Exposed Pad
Number of Pins 6
Operating Temperature-5°C~75°C
PackagingTape & Reel (TR)
Published 2008
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Technology CMOS
Voltage - Supply 2.85V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3.3V
Terminal Pitch0.5mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BU7322
Pin Count6
Qualification StatusNot Qualified
Power Supplies3.3V
Number of Circuits 1
Frequency (Max) 49.5MHz
Input Clock
Ratio - Input:Output 1:1
Primary Clock/Crystal Frequency-Nom 27MHz
PLL Yes
Differential - Input:Output No/No
Output Clock Frequency-Max 49.5MHz
Main Purpose Digital Cameras
Height Seated (Max) 0.75mm
RoHS StatusROHS3 Compliant
In-Stock:1343 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About BU7322HFV-TR

The BU7322HFV-TR from ROHM Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features IC CLK GENERATOR 1CH 6-HVSOF.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BU7322HFV-TR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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