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BH2223GLU-E2

BH2223GLU-E2

BH2223GLU-E2

ROHM Semiconductor

300mW μW DAC Voltage - Buffered Surface Mount R-2R R 1 B B

SOT-23

BH2223GLU-E2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 28-VFLGA
Number of Pins 28
Operating Temperature-25°C~85°C
PackagingTape & Reel (TR)
Published 2004
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Power Dissipation300mW
Base Part Number BH22*
Output Type Voltage - Buffered
Interface Serial
Max Supply Voltage5.5V
Min Supply Voltage2.7V
Number of Bits 8
Architecture R-2R
Supply Type Single
Data InterfaceSPI
Differential OutputNo
Resolution 1 B
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Number of D/A Converters 10
RoHS StatusROHS3 Compliant
In-Stock:4307 items

Pricing & Ordering

QuantityUnit PriceExt. Price

BH2223GLU-E2 Product Details

BH2223GLU-E2 Overview


In the 28-VFLGA package, you will find it. Surface Mount-connectors can be used to attach this FPGA module to the development board. As far as the operating temperature is concerned, it should be kept within -25°C~85°C when operating. Unlike other FPGA models, this one is contained in Tape & Reel (TR) for the sake of space saving. You can find related parts by using the part number BH22*, which is its base part number. In order to make it work, 28 pins have been designed. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. It can accept a maximum voltage of 5.5V volts as a supply voltage. A minimal supply voltage of 2.7V is required for it to operate.

BH2223GLU-E2 Features


28-VFLGA package
28 pins


BH2223GLU-E2 Applications


There are a lot of ROHM Semiconductor
BH2223GLU-E2 Digital to Analog Converters (DAC) applications.


  • Data Acquisition Systems
  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point

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