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BD8372HFP-MTR

BD8372HFP-MTR

BD8372HFP-MTR

ROHM Semiconductor

PMIC 13V TO-263-8, D2Pak (7 Leads + Tab), TO-263CA

SOT-23

BD8372HFP-MTR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case TO-263-8, D2Pak (7 Leads + Tab), TO-263CA
Surface MountYES
Operating Temperature-40°C~125°C TA
PackagingCut Tape (CT)
Published 2015
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 7
ECCN Code EAR99
Type Linear
Applications Automotive
Subcategory Display Drivers
Terminal Position SINGLE
Terminal FormGULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 13V
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count7
JESD-30 Code R-PSSO-G7
Number of Outputs 1
Qualification StatusNot Qualified
Current - Output / Channel 200mA
Internal Switch(s) Yes
Number of Segments 3
In-Stock:2339 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.992296$3.992296
10$3.766317$37.66317
100$3.553129$355.3129
500$3.352008$1676.004
1000$3.162272$3162.272

About BD8372HFP-MTR

The BD8372HFP-MTR from ROHM Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features PMIC 13V TO-263-8, D2Pak (7 Leads + Tab), TO-263CA.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BD8372HFP-MTR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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