XC3S50-4CPG132I Overview
In the package 132-TFBGA, CSPBGA, this product is provided. Having 89 I/Os makes data transfers more coherent. A fundamental building block contains 1728 logic elements or cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the Spartan?-3 series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 73728 bFpga chipss. A total of 192 LABs/CLBs make up this FPGA array. 50000 gates make up the basic block of its construction. The supplier of the device package is 132-CSPBGA (8x8).
XC3S50-4CPG132I Features
89 I/Os
Up to 73728 RAM bits
XC3S50-4CPG132I Applications
There are a lot of Rochester Electronics, LLC XC3S50-4CPG132I FPGAs applications.
- Solar Energy
- Data center hardware accelerators
- Enterprise networking
- Automotive
- Computer hardware emulation
- Medical ultrasounds
- Random logic
- Automotive Applications
- Image processing
- Embedded Vision
