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TPS2343DDP

TPS2343DDP

TPS2343DDP

Rochester Electronics, LLC

Tube Obsolete 12 Surface Mount Hot Swap Controllers Latched Fault, Thermal Limit 80-TFSOP (0.240, 6.10mm Width) Exposed Pad 12 PCI, PCI-X Hot Plug Controller

SOT-23

TPS2343DDP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 80-TFSOP (0.240, 6.10mm Width) Exposed Pad
Supplier Device Package 80-HTSSOP
Operating Temperature-40°C~85°C
PackagingTube
Feature Latched Fault, Thermal Limit
Part StatusObsolete
Moisture Sensitivity Level (MSL) 2 (1 Year)
Type Hot Plug Controller
Applications PCI, PCI-X
Voltage - Supply 1.5V 3.3V 5V ±12V
Number of Channels 12
Current - Output (Max) 100mA 375mA 1.1A
Internal Switch(s) Both
Programmable FeaturesCurrent Limit, Slew Rate
RoHS StatusROHS3 Compliant
In-Stock:791 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$10.20000$10.2
500$10.098$5049
1000$9.996$9996
1500$9.894$14841
2000$9.792$19584
2500$9.69$24225

TPS2343DDP Product Details

TPS2343DDP Overview


You get it with the 80-TFSOP (0.240, 6.10mm Width) Exposed Pad package.Currently, 12 channels can be accessed.Hot-swappable device comes in the shape of a Tube.The way it's set up is the way Surface Mount wants it.In electrical components, Hot Plug Controller is the classification.If you want reliable performance, you should set the temperature to -40°C~85°C.Hot-swappable device has PCI, PCI-X applications.There is a reference to it in Latched Fault, Thermal Limit.If the power source is 1.5V 3.3V 5V ±12VV, it should work fine.Current Limit, Slew Rate features are programmable.Device output is 100mA 375mA 1.1AV at its maximum.

TPS2343DDP Features


Features of Latched Fault, Thermal Limit
Programmable features of Current Limit, Slew Rate


TPS2343DDP Applications


There are a lot of Rochester Electronics, LLC
TPS2343DDP hot swap controllers applications.


  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems

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