Name: OMAPL138BZCEA3R
Brand: Rochester Electronics, LLC
SKU: OMAPL138BZCEA3R
Availability: InStock

new-10%

OMAPL138BZCEA3R

Manufacturer part number:OMAPL138BZCEA3R

Manufacturer:Rochester Electronics, LLC

Description:ARM926EJ-S Microprocessor OMAP-L1x Series 361-LFBGA

Case Package:SOT-23

Datasheet:OMAPL138BZCEA3R Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Package / Case	361-LFBGA
Supplier Device Package	361-NFBGA (13x13)
Operating Temperature	-40°C~105°C TJ
Packaging	Tape & Reel (TR)
Series	OMAP-L1x
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Speed	375MHz
Core Processor	ARM926EJ-S
Voltage - I/O	1.8V 3.3V
Ethernet	10/100Mbps (1)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	SDRAM
USB	USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Additional Interfaces	HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART
Co-Processors/DSP	Signal Processing; C674x, System Control; CP15
Security Features	Boot Security, Cryptography
Display & Interface Controllers	LCD
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant

OMAPL138BZCEA3R Product Details

OMAPL138BZCEA3R Overview

With a packing size of 361-LFBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tape & Reel (TR). CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~105°C TJ. A OMAP-L1x series item. A ARM926EJ-S processor is present in this CPU. The CPU contains SDRAM RAM controllers. This microprocessor is equipped with an interface of HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART. 1.8V 3.3V is the CPU's I/O address. A supplier offers a 361-NFBGA (13x13) package.