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OMAPL137BZKBA3

OMAPL137BZKBA3

OMAPL137BZKBA3

Rochester Electronics, LLC

ARM926EJ-S Microprocessor OMAP-L1x Series 256-BGA

SOT-23

OMAPL137BZKBA3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-BGA
Supplier Device Package 256-BGA (17x17)
Operating Temperature-40°C~105°C TJ
PackagingTray
Series OMAP-L1x
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 375MHz
Core Processor ARM926EJ-S
Voltage - I/O 1.8V 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers SDRAM
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Additional Interfaces HPI, I2C, McASP, MMC/SD, SPI, UART
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Display & Interface ControllersLCD
RoHS StatusROHS3 Compliant
In-Stock:1229 items

OMAPL137BZKBA3 Product Details

OMAPL137BZKBA3 Overview


With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~105°C TJ. A OMAP-L1x series item. A ARM926EJ-S processor is present in this CPU. The CPU contains SDRAM RAM controllers. This microprocessor is equipped with an interface of HPI, I2C, McASP, MMC/SD, SPI, UART. 1.8V 3.3V is the CPU's I/O address. A supplier offers a 256-BGA (17x17) package.

OMAPL137BZKBA3 Features


ARM926EJ-S Core


OMAPL137BZKBA3 Applications


There are a lot of Rochester Electronics, LLC
OMAPL137BZKBA3 Microprocessor applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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