LFSCM3GA80EP1-6FCN1152C Overview
In the 1152-BBGA package, you will find fpga chips. There are 660 I/Os for better data transfer. A fundamental building block consists of 80000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. A supply voltage of 0.95V~1.26V is needed in order for fpga chips to operate. FPGAs belonging to the SCM series are a type of FPGA that belong to the SCM series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. A model of this FPGA is contained in Tray for the purpose of saving space. There are 5816320 RAM bits that are available with this device. A total of 20000 LABs/CLBs make up this FPGA array. The device package supplied by 1152-FCBGA (35x35) is one of its suppliers.
LFSCM3GA80EP1-6FCN1152C Features
660 I/Os
Up to 5816320 RAM bits
LFSCM3GA80EP1-6FCN1152C Applications
There are a lot of Rochester Electronics, LLC LFSCM3GA80EP1-6FCN1152C FPGAs applications.
- Data Mining
- Industrial IoT
- Data Center
- ASIC prototyping
- Industrial Ethernet
- Automotive
- Camera time adjustments
- Telecommunication
- Wired Communications
- Data center hardware accelerators
