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HC55185DIM

HC55185DIM

HC55185DIM

Rochester Electronics, LLC

28 TerminationsTelecom device1 Circuits

SOT-23

HC55185DIM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 28-LCC (J-Lead)
Surface MountYES
Operating Temperature-40°C~85°C
PackagingTube
Series RSLIC18
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28
Terminal Finish TIN LEAD
Technology BIPOLAR
Terminal Position QUAD
Terminal FormJ BEND
Peak Reflow Temperature (Cel) 240
Supply Voltage 5V
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQCC-J28
Function Subscriber Line Interface Concept (SLIC)
Qualification StatusNot Qualified
Number of Circuits 1
Height Seated (Max) 4.57mm
RoHS StatusNon-RoHS Compliant
In-Stock:1829 items

HC55185DIM Product Details

HC55185DIM Overview


In order to save space on the board, the 28-LCC (J-Lead) package is used.Telecommunications equipment is packed using the Tube method.The mounting type of this telecom circuit is Surface Mount.A 1-circuit composes this telecom IC .A -40°C~85°C-temperature setting offers reliable performance.28 terminations can be found in the configuration.The supply voltage it operates with is 5V.This part can perform many functions similar to the electronic parts under the RSLIC18 series.

HC55185DIM Features


Available in the 28-LCC (J-Lead) package

HC55185DIM Applications


There are a lot of Rochester Electronics, LLC HC55185DIM Telecom applications.

  • ISDN terminal adapter
  • Fiber in the loop (FITL)
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Routers
  • Hybrid fiber coax (HFC)
  • Channel Banks
  • High speed data transmission line cards
  • DECT (Digital European Cordless Telephone) Base Stations
  • Fiber Optic Terminals
  • Interfaces to E3

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