DS2175N Overview
In order to save space on the board, the 16-DIP (0.300, 7.62mm) package is used.A Tube-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Through Hole.The telecom IC is composed of 1 circuits.Wtelecom IC's efficiencyh a high supply voltage, 4.5V~5.5V can be operated more efficiently.A temperature setting of -40°C~85°C ensures reliable performance.The configuration includes 16 terminations.It requires a supply voltage of 5V.It uses the ELASTIC BUFFER IC type for its telecom IC.9mA is the supply current.
DS2175N Features
Available in the 16-DIP (0.300, 7.62mm) package
ELASTIC BUFFER as telecom IC type
DS2175N Applications
There are a lot of Rochester Electronics, LLC DS2175N Telecom applications.
- Digital access cross connects
- Fiber Optic Terminals
- High speed data transmission line cards
- Routers
- SONET/SDH terminal
- ISDN terminal adapter
- Add/Drop multiplexers (ADMs)
- Digital subscriber line access multiplexer (DSLAM)
- BITS Timing
- Multichannel DS1 Test Equipment
