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DS21552LN

DS21552LN

DS21552LN

Rochester Electronics, LLC

100 TerminationsTelecom device1 Circuits

SOT-23

DS21552LN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface MountYES
Operating Temperature-40°C~85°C
PackagingTray
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
Terminal Finish TIN LEAD
Technology CMOS
Voltage - Supply 4.75V~5.25V
Terminal Position QUAD
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 240
Supply Voltage 5V
Terminal Pitch0.5mm
[email protected] Reflow Temperature-Max (s) 20
Function Single-Chip Transceiver
Qualification StatusCOMMERCIAL
Interface E1, HDLC, J1, T1
Number of Circuits 1
Current - Supply 75mA
Telecom IC Type PCM TRANSCEIVER
RoHS StatusNon-RoHS Compliant
In-Stock:248 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$33.49000$33.49
500$33.1551$16577.55
1000$32.8202$32820.2
1500$32.4853$48727.95
2000$32.1504$64300.8
2500$31.8155$79538.75

DS21552LN Product Details

DS21552LN Overview


The 100-LQFP package reduces the amount of space on a board.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.Telecom circuit is made up of 1 circuits.Providing 4.75V~5.25V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A -40°C~85°C-temperature setting offers reliable performance.Telecom switching configuration has 100 terminations.It requires a supply voltage of 5V.Telecom ICs of type PCM TRANSCEIVER are used in it.A 75mA-volt supply current is used to operate telecom equipment .

DS21552LN Features


Available in the 100-LQFP package
PCM TRANSCEIVER as telecom IC type

DS21552LN Applications


There are a lot of Rochester Electronics, LLC DS21552LN Telecom applications.

  • Switching Systems
  • SDH Multiplexers
  • Interfaces to E3
  • Digital subscriber line access multiplexer (DSLAM)
  • Fractional T1/E1/J1
  • Hybrid fiber coax (HFC)
  • Voice over packet gateways
  • ATM equipment with integrated DS1 interfaces
  • SDH/SONET multiplexers
  • DSLAMs

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