DAC813JP Overview
There is a 28-DIP (0.300, 7.62mm) package that includes this component. FPGA modules can be attached to development boards using a Through Hole-connector. During the operation of the system, the operating temperature should remain within the range of -40°C~85°C. Using the Tube layout, this FPGA model can be contained in a very small amount of space. Device package 28-PDIP is provided by its supplier.
DAC813JP Features
28-DIP (0.300, 7.62mm) package
DAC813JP Applications
There are a lot of Rochester Electronics, LLC DAC813JP Digital to Analog Converters (DAC)?applications.
- Wideband communications:
- Digital Audio Amplifiers
- LMDS/MMDS, point-to-point
- Microprocessor Controlled Circuits
- Automatic Test Equipment
- Precision AGC Circuits
- General Purpose Trimming Adjustments
- High-End Compact Disc Players
- Servo controls
- Digital Offset & Gain Adjustment
