CYF0072V18L-133BGXI Overview
209-BGA is the package in which FIFO memory chip is contained.Tray case is used for packaging.There is a memory of 72M 2M x 36 on the FIFO chip that can be used to store applications and data.A temperature regulation of -40°C~85°C is crucial for reliable operation.This FIFO memory has a mounting type of Surface Mount .A 1.7V~1.9V supply voltage is required to power it.
CYF0072V18L-133BGXI Features
72M 2M x 36 memory size
CYF0072V18L-133BGXI Applications
There are a lot of Rochester Electronics, LLC
CYF0072V18L-133BGXI FIFOs Memory applications.
- Routers
- Cameras
- Multimedia
- TVs
- Computers
- Disk Controllers
- Communications
- Networking
- Multi-stage synchronizer
- Signal processing
