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AD8303JRU

AD8303JRU

AD8303JRU

Rochester Electronics, LLC

DACSurface Mount 4.4mm mm

SOT-23

AD8303JRU Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 14-TSSOP (0.173, 4.40mm Width)
Surface MountYES
PackagingTube
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 14
Terminal Finish MATTE TIN
Technology CMOS
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch0.65mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count14
JESD-30 Code R-PDSO-G14
Qualification StatusCOMMERCIAL
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Temperature GradeINDUSTRIAL
Number of Bits 12
Converter Type D/A CONVERTER
Settling Time14 µs
Linearity Error-Max (EL) 0.0488%
Input Bit Code BINARY
Input Format SERIAL
Analog Output Voltage-Max 2.0475V
Height Seated (Max) 1.2mm
Length 5mm
Width 4.4mm
RoHS StatusNon-RoHS Compliant
In-Stock:671 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$13.27000$13.27
500$13.1373$6568.65
1000$13.0046$13004.6
1500$12.8719$19307.85
2000$12.7392$25478.4
2500$12.6065$31516.25

AD8303JRU Product Details

AD8303JRU Overview


In the 14-TSSOP (0.173, 4.40mm Width) package, you will find it. 3V volts power it. The Surface Mount-slot on the development board allows you to attach the FPGA module. As a result of space limitations, this FPGA model has been included in Tube. The total number of terminations is 14. It is equipped with 14 pin count. It is recommended that the operating temperature should not exceed 85°C degrees centigrade. A temperature of at least -40°C should be used as the operating temperature.

AD8303JRU Features


14-TSSOP (0.173, 4.40mm Width) package
14 pin count

AD8303JRU Applications


There are a lot of Rochester Electronics, LLC AD8303JRU Digital to Analog Converters (DAC)?applications.

  • High-End Compact Disc Players
  • Mobile Communications
  • Instrumentation:
  • Digital Potentiometer
  • RF signal generators, arbitrary waveform generators
  • Wireless infrastructure:
  • Digitally controlled calibration
  • Microprocessor Controlled Calibration
  • Low bandwidth data acquisition systems
  • Video Encoder

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