AD664KN-BIP Overview
A 28-DIP (0.600, 15.24mm) package is provided with this component. An FPGA module can be attached to a development board with a Through Hole-pin. It is recommended that the operating temperature be kept within the range 0°C~70°C while the machine is operating. This FPGA model is contained in Tube for space saving. The device package supplied by 28-PDIP is one of its suppliers.
AD664KN-BIP Features
28-DIP (0.600, 15.24mm) package
AD664KN-BIP Applications
There are a lot of Rochester Electronics, LLC AD664KN-BIP Digital to Analog Converters (DAC)?applications.
- Wireless infrastructure:
- Portable Equipment
- Low bandwidth data acquisition systems
- WCDMA, CDMA2000, TD-SCDMA, WiMAX
- Data Distribution System
- Data Acquisition
- Synchro Applications
- Bus Structured instruments
- High-End Compact Disc Players
- Motor Control
