AD664JN-BIP Overview
As part of the 28-DIP (0.600, 15.24mm) package, it is included. This FPGA module can be attached to the development board with a Through Hole. When operating the machine, it is important to keep the temperature within 0°C~70°C range. It is designed to maximiTubee space efficiency by containing the FPGA model in Tube. The device package supplied by 28-PDIP is one of its suppliers.
AD664JN-BIP Features
28-DIP (0.600, 15.24mm) package
AD664JN-BIP Applications
There are a lot of Rochester Electronics, LLC AD664JN-BIP Digital to Analog Converters (DAC)?applications.
- Low bandwidth data acquisition systems
- Digital Offset & Gain Adjustment
- Synchro Applications
- Automated Test Equipment
- LMDS/MMDS, point-to-point
- Gain and offset adjustment
- Digital Radio Link
- Voltage Set Point Control
- General Purpose Trimming Adjustments
- Wireless infrastructure:
