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AD5383BST-3

AD5383BST-3

AD5383BST-3

Rochester Electronics, LLC

DAC Surface Mount 14mm mm

SOT-23

AD5383BST-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface MountYES
PackagingTray
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
Terminal Finish TIN LEAD
Terminal Position QUAD
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count100
JESD-30 Code S-PQFP-G100
Qualification StatusCOMMERCIAL
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Temperature GradeINDUSTRIAL
Number of Bits 12
Converter Type D/A CONVERTER
Settling Time6 µs
Linearity Error-Max (EL) 0.0244%
Input Bit Code BINARY
Input Format PARALLEL, WORD
Analog Output Voltage-Max 3.6V
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
RoHS StatusNon-RoHS Compliant
In-Stock:198 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$54.11000$54.11
500$53.5689$26784.45
1000$53.0278$53027.8
1500$52.4867$78730.05
2000$51.9456$103891.2
2500$51.4045$128511.25

AD5383BST-3 Product Details

AD5383BST-3 Overview


A 100-LQFP package is provided with this component. An electrical supply voltage of 3V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 100 terminations. In addition to this, it has 100 pins. If the temperature of the operating system exceeds 85°C degrees Celsius, it is not recommended. There should be at least a temperature of -40°C in the operating area.

AD5383BST-3 Features


100-LQFP package
100 pin count


AD5383BST-3 Applications


There are a lot of Rochester Electronics, LLC
AD5383BST-3 Digital to Analog Converters (DAC) applications.


  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications

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