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AD5381BST-3

AD5381BST-3

AD5381BST-3

Rochester Electronics, LLC

DACSurface Mount 14mm mm

SOT-23

AD5381BST-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface MountYES
PackagingTray
JESD-609 Code e0
Pbfree Code no
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
Terminal Finish TIN LEAD
Terminal Position QUAD
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch0.5mm
[email protected] Reflow Temperature-Max (s) 30
Pin Count100
JESD-30 Code S-PQFP-G100
Qualification StatusCOMMERCIAL
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Temperature GradeINDUSTRIAL
Number of Bits 12
Converter Type D/A CONVERTER
Settling Time6 µs
Linearity Error-Max (EL) 0.0244%
Input Bit Code BINARY
Input Format PARALLEL, WORD
Analog Output Voltage-Max 3.6V
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
RoHS StatusNon-RoHS Compliant
In-Stock:156 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$61.96000$61.96
500$61.3404$30670.2
1000$60.7208$60720.8
1500$60.1012$90151.8
2000$59.4816$118963.2
2500$58.862$147155

AD5381BST-3 Product Details

AD5381BST-3 Overview


There are two packages that contain it: 100-LQFP package and X package. The supply voltage is 3V volts. With a Surface Mount connector, this FPGA module can be attached to the development board. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are a total of 100 terminations. I am going to present you with a device that is equipped with 100 pins. As a rule of thumb, the operating temperature should not exceed 85°C. There should be no less than a -40°C operating temperature in the machine.

AD5381BST-3 Features


100-LQFP package
100 pin count

AD5381BST-3 Applications


There are a lot of Rochester Electronics, LLC AD5381BST-3 Digital to Analog Converters (DAC)?applications.

  • Low Cost I/O
  • Instrumentation
  • Waveform Reconstruction
  • Wideband communications:
  • Digital Audio Amplifiers
  • Wireless infrastructure:
  • Audio Amplifier
  • Precision AGC Circuits
  • Digitally Controlled Attenuators and Power Supplies
  • LMDS/MMDS, point-to-point

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