XC3190A-3PQ160C Overview
This package is included in the PQFP package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. Using the Bulk layout, this FPGA model can be contained in a very small amount of space. During the configuration of this FPGA module, the RAM si7.8kBe reaches 7.8kB to ensure that the program runs normally. The device is designed with 160 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 5V supply voltage, designers can take full advantage of its flexibility. In this module, 85°C is the maximum operating temperature at which fpga electronics can operate. Over 0°C, the operating temperature should be higher. Fpga semiconductor is made up of 6000 gates as fpga semiconductors basic building block. In its basic building block, it is composed of 320 logic blocks (LABs), which are called building blocks. A total of 928 registers are used for storing and transferring data between them.
XC3190A-3PQ160C Features
138 I/Os
160 LABs/CLBs
85°C gates
320 logic blocks (LABs)
928 registers
XC3190A-3PQ160C Applications
There are a lot of Rochester Electronics
XC3190A-3PQ160C FPGAs applications.
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
