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ISL8202MIRZ-T

ISL8202MIRZ-T

ISL8202MIRZ-T

Renesas Electronics America Inc.

ISL8202MIRZ-T datasheet pdf and DC DC Converters product details from Renesas Electronics America Inc. stock available on our website

SOT-23

ISL8202MIRZ-T Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mounting Type Surface Mount
Package / Case 22-PowerFQFN Module
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Size / Dimension 0.30Lx0.18W x 0.07 H 7.5mmx4.5mmx1.9mm
JESD-609 Code e3
Feature OCP, OTP, OVP, SCP, UVLO
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Non-Isolated PoL Module
Terminal Finish Matte Tin (Sn)
Applications ITE (Commercial)
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Pin Count22
Number of Outputs 1
Efficiency 95%
Voltage - Input (Max) 5.5V
Voltage - Output 1 0.6V~5.2V
Voltage - Input (Min) 2.6V
Current - Output (Max) 3A
RoHS StatusROHS3 Compliant
In-Stock:1547 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About ISL8202MIRZ-T

The ISL8202MIRZ-T from Renesas Electronics America Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features ISL8202MIRZ-T datasheet pdf and DC DC Converters product details from Renesas Electronics America Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the ISL8202MIRZ-T, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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