IDT72T20118L5BB Overview
208-BGA is the package in which FIFO memory chip is contained.Tray case is used for packaging.There is a memory of 2.5M 128K x 20 256K x 10 on the FIFO chip that can be used to store applications and data.A temperature regulation of 0°C~70°C is crucial for reliable operation.This FIFO memory has a mounting type of Surface Mount .A 2.375V~2.625V supply voltage is required to power it.It is a component from the 72T series.A FIFO's maximum operating supply current of 60mA is available.In terms of its family, it is part of the 72T20118 family.
IDT72T20118L5BB Features
2.5M 128K x 20 256K x 10 memory size
72T series
Best part number of 72T20118
IDT72T20118L5BB Applications
There are a lot of Renesas Electronics America Inc.
IDT72T20118L5BB FIFOs Memory applications.
- Routers
- Cameras
- Multimedia
- TVs
- Computers
- Disk Controllers
- Communications
- Networking
- Multi-stage synchronizer
- Signal processing
