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IDT2309B-1HDCG8

IDT2309B-1HDCG8

IDT2309B-1HDCG8

Renesas Electronics America Inc.

Zero Delay Buffer 133MHz IDT2309-1 Clock Generators 16-SOIC (0.154, 3.90mm Width) Surface Mount 3V~3.6V Tape & Reel (TR)

SOT-23

IDT2309B-1HDCG8 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 16-SOIC (0.154, 3.90mm Width)
Supplier Device Package 16-SOIC
Operating Temperature0°C~70°C
PackagingTape & Reel (TR)
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Zero Delay Buffer
Voltage - Supply 3V~3.6V
Base Part Number IDT2309-1
Output LVTTL
Number of Circuits 1
Frequency (Max) 133MHz
Input LVTTL
Ratio - Input:Output 1:9
PLL Yes with Bypass
Differential - Input:Output No/No
Divider/Multiplier No/No
In-Stock:4468 items

IDT2309B-1HDCG8 Product Details

IDT2309B-1HDCG8 Overview


Clock ICs are packaged using the Tape & Reel (TR) method. The 16-SOIC (0.154, 3.90mm Width) package includes this clock generator. The input of this clock generator is designed to be LVTTL. For full access to the electronic component's capabilities, 1 circuits are implemented. Providing a maximum frequency of 133MHz, this clock-based RF synthesizer is suitable for a variety of applications. This component can be conveniently installed on the panel thanks to the Surface Mount. In terms of supply voltage, RF synthesizer works with 3V~3.6V. By calculating the test statistics, 0°C~70°C is the appropriate ambient temperature. It's compatible with LVTTL logic levels. It has been classified as a Zero Delay Buffer electronic part, which means that it is a semiconductor. You can find related electrical components to the base part number IDT2309-1.

IDT2309B-1HDCG8 Features


Available in the 16-SOIC (0.154, 3.90mm Width)

IDT2309B-1HDCG8 Applications


There are a lot of Renesas Electronics America Inc. IDT2309B-1HDCG8 Clock Generators applications.

  • Simple clock clean-up circuits
  • Digital logic circuits
  • Test equipment
  • Local oscillator source in receiver
  • FPGA and processor clocks
  • Broadcast communication
  • Multi-function printers
  • Ports
  • Communication infrastructure
  • Wireless infrastructure

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