HI5741BIB-T Overview
A 28-SOIC (0.295, 7.50mm Width) package is provided with this component. An FPGA module can be attached to a development board with a Surface Mount-pin. During the operation of the system, the operating temperature should remain within the range of -40°C~85°C. It is for space saving reasons that this FPGA model is contained in Tape & Reel (TR). Related parts can be found by using its base part number HI5741.
HI5741BIB-T Features
28-SOIC (0.295, 7.50mm Width) package
HI5741BIB-T Applications
There are a lot of Renesas Electronics America Inc.
HI5741BIB-T Digital to Analog Converters (DAC) applications.
- Data Distribution System
- Digital Potentiometer
- Software Radio
- Wireless infrastructure:
- WCDMA, CDMA2000, TD-SCDMA, WiMAX
- Wideband communications:
- LMDS/MMDS, point-to-point
- Instrumentation:
- RF signal generators, arbitrary waveform generators
- Mobile Communications
