HI5731BIB-T Overview
There are two packages that contain it: 28-SOIC (0.295, 7.50mm Width) package and X package. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within -40°C~85°C range. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. In order to find related parts, use the part number HI5731 as a base.
HI5731BIB-T Features
28-SOIC (0.295, 7.50mm Width) package
HI5731BIB-T Applications
There are a lot of Renesas Electronics America Inc.
HI5731BIB-T Digital to Analog Converters (DAC) applications.
- Digital Potentiometer
- Software Radio
- Wireless infrastructure:
- WCDMA, CDMA2000, TD-SCDMA, WiMAX
- Wideband communications:
- LMDS/MMDS, point-to-point
- Instrumentation:
- RF signal generators, arbitrary waveform generators
- Mobile Communications
- Process Control and Industrial Automation
