82P2821BHG Overview
Saving board space is achieved with the 640-BGA Exposed Pad package.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Surface Mount.1 circuits make up this telecom IC .The voltage supplied to 1.8V 3.3V can improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.IDT82P2821 is the base part number, which can be used to find more related parts.
82P2821BHG Features
Available in the 640-BGA Exposed Pad package
82P2821BHG Applications
There are a lot of Renesas Electronics America Inc. 82P2821BHG Telecom applications.
- Central office
- Digital Cross-Connect Systems
- Fiber Optic Terminals
- CSU/DSU E1 Interface
- Integrated Multi-Service Access Platforms (IMAPs)
- Cable Modem
- ISDN Primary Rate Interface
- High-Density T1/E1/J1 interfaces for Multiplexers
- Channel Banks
- NIU
