74SSTUBF32868ABKG Overview
As a packaging method, Tray is used.The 176-TFBGA package contains it.To ensure normal operation of the device, 1.7V~1.9V is supplied.A Surface Mount mounting method is used for mounting electronic parts.The operating temperature is set to 0°C~70°C.Information is stored in the memory with a size of 28 bits.Based on its base part number 74SSTUB32868, related parts can be found.
74SSTUBF32868ABKG Features
74SSTUBF32868ABKG Applications
There are a lot of Renesas Electronics America Inc.
74SSTUBF32868ABKG Specialty Logic ICs applications.
- Cell phones
- Wireless modems
- Remote controls
- Wireless network systems
- Satellite communications networks
- Ethernet circuitry
- Wired telephone
- Cordless telephone
- Desktop PC
- Notebook