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B39162B8666L210

B39162B8666L210

B39162B8666L210

Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)

CSSP3 DPLX GT

SOT-23

B39162B8666L210 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 10-SMD, No Lead
PackagingTape & Reel (TR)
Series B8666
Size / Dimension 0.067Lx0.051W 1.70mmx1.30mm
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications GPS
Bandwidth 46.84MHz
Insertion Loss1.5dB
Frequency - Cutoff or Center 2.15GHz
Height (Max) 0.024 0.60mm
RoHS StatusROHS3 Compliant
In-Stock:2754 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.244394$2.244394
10$2.117353$21.17353
100$1.997503$199.7503
500$1.884437$942.2185
1000$1.777771$1777.771

About B39162B8666L210

The B39162B8666L210 from Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) is a high-performance microcontroller designed for a wide range of embedded applications. This component features CSSP3 DPLX GT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B39162B8666L210, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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