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A41-80-28A33

A41-80-28A33

A41-80-28A33

Pulse Electronics Power

XFRMR LAMINATED 80VA CHAS MOUNT

SOT-23

A41-80-28A33 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact PlatingLead, Tin
Mount Chassis Mount, Flanges
Mounting Type Chassis Mount
Weight 2.8lbs 1.3kg
Published 2007
Series International High Power
Size / Dimension 63.50mm Lx77.47mm W
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Laminated Core
Additional FeaturePARALLEL CONNECTED
Power Rating 80W
Max Power Dissipation80W
Termination Style Solder, Quick Connect
Approval Agency UL; CSA; TUV
Physical Dimension L63.5XB60.32XH76.2 (mm)
Max Output Current2.8A
Current - Output (Max) Parallel 5.6A Series 2.8A
Power - Max 80VA
Lead/Base Style Solder
Output Voltage 1 14V
Isolation Voltage4000V
Voltage - Primary 115V 230V
Primary Winding(s) Dual
Center TapNo
Voltage - Secondary (Full Load) Parallel 14V Series 28V
Output Voltage 2 14V
Number of Secondary Winding 2
VA Rating 80 VA
Height 77.47mm
Height Seated (Max) 60.32mm
Length 63.5mm
Width 60.32mm
RoHS StatusRoHS Compliant
In-Stock:4213 items

About A41-80-28A33

The A41-80-28A33 from Pulse Electronics Power is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 80VA CHAS MOUNT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A41-80-28A33, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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