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894-80-036-20-002101

894-80-036-20-002101

894-80-036-20-002101

Preci-Dip

894 Series 3-Row Header Solder Brass Bulk Through Hole, Right Angle Tin Polyamide (PA), Nylon, Glass Filled 36-Position Board to Board 0.300 7.62mm Height

SOT-23

894-80-036-20-002101 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBrass
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Polyamide (PA), Nylon, Glass Filled
Operating Temperature-55°C~125°C
PackagingBulk
Series 894
Published 2012
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 36
Number of Rows 3
Voltage - Rated 150VDC
Fastening TypePush-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Current Rating (Amps) 3A
Insulation Height 0.300 7.62mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.118 3.00mm
Shrouding Unshrouded
Contact Length - Mating 0.276 7.00mm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:1444 items

Pricing & Ordering

QuantityUnit PriceExt. Price
130$4.18723$544.3399

894-80-036-20-002101 Product Details

894-80-036-20-002101 Overview


The product is packaged in Header.This device is mounted in the Through Hole, Right Angle position.It has been determined that a Bulk case is necessary to package the product.There is a product in the 894 Series.Part Through Hole is mounted to the part.As a result, the device runs at -55°C~125°C Operating Temperature.

894-80-036-20-002101 Features


894 series


894-80-036-20-002101 Applications


There are a lot of Preci-Dip
894-80-036-20-002101 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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