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830-80-044-20-001101

830-80-044-20-001101

830-80-044-20-001101

Preci-Dip

830 Series 1-Row Header Solder Brass Bulk Through Hole, Right Angle Tin Liquid Crystal Polymer (LCP), Glass Filled 44-Position Board to Board 0.087 2.20mm Height

SOT-23

830-80-044-20-001101 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBrass
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Circular
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Operating Temperature-55°C~125°C
PackagingBulk
Series 830
Published 2012
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 44
Number of Rows 1
Voltage - Rated 150VDC
Fastening TypePush-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Current Rating (Amps) 3A
Terminal Pitch2.0066mm
Insulation Height 0.087 2.20mm
Style Board to Board
Number of Positions Loaded All
Reach Compliance Code unknown
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Body Length or Diameter 3.465 inch
Contact Length - Post 0.126 3.20mm
Shrouding Unshrouded
Number Of PCB Rows 1
Contact Length - Mating 0.141 3.60mm
PCB Contact Pattern RECTANGULAR
Body Breadth 0.087 inch
Mating Contact Pitch 0.079 inch
Durability 500 Cycles
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:1202 items

Pricing & Ordering

QuantityUnit PriceExt. Price
140$3.85857$540.1998

830-80-044-20-001101 Product Details

830-80-044-20-001101 Overview


A Header package is included with it.Its mounting type is Through Hole, Right Angle.Packaging is performed using a Bulk case.It is part of the 830 Series of products.Through Hole mounts the part.There is no operating temperature for the device.

830-80-044-20-001101 Features


830 series


830-80-044-20-001101 Applications


There are a lot of Preci-Dip
830-80-044-20-001101 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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