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370-10-102-00-001101

370-10-102-00-001101

370-10-102-00-001101

Preci-Dip

HEADER TURRET SOLDER TAIL 2.54MM

SOT-23

370-10-102-00-001101 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Through Hole
Mounting Type Through Hole
Insulation Material GLASS FILLED POLYESTER
PackagingBulk
Published 2012
Series 370
JESD-609 Code e4
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Header Strip
Number of Positions 2
Color Black
Number of Rows 1
HTS Code8536.69.40.40
Subcategory Headers and Edge Type Connectors
Contact Type Turret
Pitch 0.100 2.54mm
Total Number of Contacts 2
Number of Conductors ONE
Reference Standard UL
Contact Finish Gold
Reliability COMMERCIAL
Number Of PCB Rows 1
PCB Contact Pattern RECTANGULAR
Operating Temperature (Min) -55°C
Rated Current (Signal) 3A
Contact Finish Thickness 10.0μin 0.25μm
RoHS StatusROHS3 Compliant
In-Stock:22324 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.771926$0.771926
10$0.728232$7.28232
100$0.687011$68.7011
500$0.648124$324.062
1000$0.611438$611.438

About 370-10-102-00-001101

The 370-10-102-00-001101 from Preci-Dip is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEADER TURRET SOLDER TAIL 2.54MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 370-10-102-00-001101, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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